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SERIAL ITEM TECHNICAL DATA
1 Board Type Rigid Board, RF
2 Material FR4 Standard TG 140 °C, ROGERS, TEFLON
3 Layers 1-8 Layers Pcb Prototype
4 Max Board Size 400mm * 600mm
5 Board Thickness 0.25mm - 3.20mm
6 Min line Width 0.15 mm
7 Min Space Width 0.1 mm
8 Min Hole Size 0.2 mm
9 Min Annular Ring 0.15mm
10 Copper Thickness 35um - 70um
11 Inner Layer Copper Thickness 18um ,35um
12 Solder Mask Color Green, Black, White, Blue, Red, Yellow
13 Silkscreen (Legend) Color White, Black, Yellow
14 Surface Finishing HASL - Hot Air Solder Leveling
ENIG - Electro less Nickel / Immersion
Gold
15 Electrical Test Yes
16 AOI (Automatic Optical Inspection) Test Yes
17 Min Core Thickness For Multilayer 0.25 mm
18 FR4 TG 140 °C Prepreg Specification For Multi layer 106 RC 71.5% 57um
1080 RC 62% 76um
2113 RC 56% 100um
2116 RC 53% 130um
7628 RC 43% 200um

 

 

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